Efficient development processes and fast troubleshooting in research and development

Are you aware of all the things you can measure using a thermal imager in the research and development field?

A highly sensitive thermal imager enables

  • Targeted detection of predetermined breaking points
  • Determination of thermal anomalies in real time and monitoring of cooling and heating processes
  • Performance of safety checks on electrical components
  • Analysis of heat development and dissipation on circuit boards and optimization of development processes


Find out more about how thermal imagers from Testo can support you with thermally demanding development tasks.

  • Process analysis package Prozessanalysepaket

    Process analysis package

    Order-Nr. 0554 8902

    SAR 4 764
    excl. VAT
    • Can be used as an extension for the testo 885 and testo 890
    • Recording time can be controlled via limit value definition

Thermal decoupling of components

Thermal image insulation
Thermal image insulation

Components subject to significant heating and temperature-sensitive components are often located close together in large assemblies. To prevent sensitive components from overheating, individual components or whole areas have to be thermally decoupled. How a thermal imager will support you:

  • Measurement of heat distribution and analysis with the testo IRSoft thermography software
  • Checking of tests and analyses with different insulation materials
  • Optimum layout of insulation and avoidance of unnecessarily high unit costs
  • Fast troubleshooting if the thermal decoupling is not working
  • Development of efficient solutions for cooling components

Developing mechanical components

Thermographic imaging of mechanical components
Thermal image mechanical component

Excessive temperatures in the mechanics can have a negative impact on components. In research and development involving mechanical components or entire assemblies, the focus is therefore on heat development. How a thermal imager will support you:

  • Visualization of thermal anomalies in real time and fast identification of the cause (e.g. friction)
  • Analysis of heat dissipation within assemblies or on components